Xilinx Spartan™-3 FPGA, in FG456 package, fitted to the board. Available in four part sizes XC3S400, XC3S1000, XC3S1500 or XC3S2000. Virtex™-4 and Virtex™-5 support with Moel-Bryn expansion socket supporting Swinyard 1 modules.
32 bit, 33 MHz, 5V PCI interface. Otherwise to use this interface you will need a PCI core license, or own design, or to purchase a custom FPGA design bitstream from Enterpoint.
Currently we are only supporting this socket as a I/O port not as DDR2 memory.
LHS DIL HEADER
Consists of two sets of header 34 positions high supporting components, or expansion boards, of 0.3 / 0.4 / 0.6 / 1.5 inch horizontal pitch between legs. Vertical pitch is 0.1 inch. A total of 60 signals are additionally wired to the left hand side card edge connector (0.1 pitch 30×2). A local power rail of either 1.8V, 2.5V or 3.3V is available to this header. All signals are connected to the Spartan™-3. Solder bridges allow the connection of the local power rail to any pin on the right hand side of this connector. Similarly 0V (GND) can be connected to any pin on the left hand side of this connector.
RHS DIL HEADER
Consists of two sets of header 34 positions high supporting components, or expansion boards, of 0.3 / 0.4 / 0.6 inch horizontal pitch between legs. Vertical pitch is 0.1 inch. Please note that only the bottom 16 positions, on each side of the RHS DIL Header , are connected to the Spartan™-3. Future versions of the XC3S1000 and XC3S1500 board variants will have full height signal connections to the Spartan™-3. A local power rail of either 1.8V, 2.5V or 3.3V is available to this header. Solder bridges allow the connection of the local power rail to any pin on the right hand side of this connector. Similarly 0V (GND) can be connected to any pin on the left hand side of this connector.
MOEL BRYN EXPANSION POSITION
Broaddown 2 has a single position for Moel Bryn Expansion boards. This expansion module position is located on the back of the board. A number different expansion boards will be available for this expansion position including the high I/O Swinyard Virtex ™-4 modules. The Swinyard1 module is available with the following Virtex™-4 devices – LX40, LX60, LX80, LX100, LX160, SX55.
STAND ALONE POWER CONNECTOR
Broaddown 2 has a disk drive type connector fitted allowing the board to operate outside a computer environment. Using this connector allows more I/O availability or alternative supports higher current operation of Broaddown 2 whilst plugged into a computer.
Broaddown 2 has been built to support higher power applications. A 50 mm fan may be optionally fitted above the primary regulators – 4.1V, 3.3V, 2.5, 1.8V. Without forced cooling a total summation current (all regulators under 5V) of 3 amps is available on Broaddown 2. Broaddown 2 has a 50 mm fan position over the primary regulators and with this fitted the supported current rating rises to 5 amps. If your application needs more current the primary regulator chain can deliver 7.5 amps under special circumstances. However before running the board with currents of this magnitude please contact sales for advice on the special cooling requirements and limitations of running with these very high currents.
Individually the following regulators can deliver the maximum currents of (normal / standard fan / special cooling):
+4.1V Rail – 3 / 5 / 7.5 amps
+3.3V Rail – 3 / 5 / 7.5 amps
+2.5V Rail – 3 / 5 / 7.5 amps
+1.8V Rail – 3 / 5 / 7.5 amps
+1.5V Rail – 2 amps
+1.2V Rail – 2 amps
VCCAUX – 1 amp
VCCAUX2 – 1amp
V_USER1 – 2 amps (1.2 to 4.3V)
V_USER2 – 1 amp (1.2 to 4.3V)
V_NEG1 – 100 milliamps (-3.3V, -5V, -12V)
V_NEG2 – 100 milliamps (-3.3V, -5V, -12V)
V_REF – 1.5 amps (push – pull regulator for sodimm socket at 1.25V or 0.9V)
BANK I/O VOLTAGES
With the exception of banks 6 and 7 of the Spartan™-3, which are tied together, individual banks may be operated with Vcco’s of 1.2V, 1.5V, 1.8V, 2.5V and 3.3V. Selection between 1.2V and 1.5V is made by means of solder bridges and you should state, when ordering, if you wish these to be supplied made. The higher voltage selection is made by jumper selection.
Vref voltages are selectable for banks 2,3,4 of the Spartan™-3. Please ask for technical assistance if you wish to use Vref in any other banks.
We are doing a special version of our Drigmorn 1 product that allows it to be used as a Coprocessor, Flash memory, SRAM, Clock Generator and RS232 for Broaddown 2. Details of Drigmorn 1 are here.
Broaddown 2 can be made with a variety of OVERCOAT options. OVERCOAT allows to the stacking of Broaddown 2s together to form an array of FPGAs. This option is a variation fit of the DIL headers and gives up 80 I/O connections between boards in its simplistic form. This technique is very useful for forming microprocessor arrays of MicroBlaze™ or generally for array processing. This option is available to special order only.
DERIVATIVE, TURNKEY or MODULE DESIGNS
We are happy to offer derivative designs of Broaddown 2 to customers with special requirements. Subject to requirements and part availability we can usually deliver prototypes of turnkey custom designs in approximately 6 to 10 weeks. We can also offer custom expansion modules. We can usually deliver module prototypes in 2 to 4 weeks subject to part availability. Please ask for a quote if you are interested in these services.